Effects of Hybrid Structures on the Stress Reduction and Thermal Properties of Joints in Electronics Devices

Abstract

Electronics devices consist of silicon chips, copper leads, resin or ceramics substrates and which are jointed to each other with solder, conductive adhesive or other materials. Each coefficient of thermal expansion is different and it causes strain concentration and cracks. The solder easily deformed by the difference of the thermal expansion and it relieved the stress on the devices however the epoxy resin of the conductive adhesives are harder. So we suggested the composed joint including the relaxation layers of low elastic material. The shear strength and elongation of the epoxy resin joint, silicone rubber joint and the composite joint of the two materials were investigated. The analytical study was carried out to clarify the stress reduction effect of the design of the relaxation layer in the composite joints. The parameters such as the width, height, pitch and the distance of the relaxation layer from the joint edge are investigated. The high relaxation layer close to the joint edge effectively reduced the stress of the joint. The stress reduction effect appeared in the different pitch of the layers.