Effects of hot compression on distribution of Σ3n boundary and mechanical properties in Cu–Sn alloy

Abstract

Cu–Sn alloy was put in the high-temperature hot compression test with a strain rate of 0.01 s−1 and distortion temperature of 550–700 °C. Electron backscattered diffraction technology was adopted to analyze the distortion and microstructure features of different parts of the alloy. The results indicate that: As the temperature rises, the distribution frequency of the Σ3n (n = 1, 2, 3) grain boundary increases to 41.9% from 6.8% but drops suddenly at 650 °C, which is similar to the frequency distribution changes in recrystallization and twin crystals. Meanwhile, multiple annealing twin crystals are generated and connected to form grain clusters with Σ3n orientation among each other. In the inverse pole figure, with the recrystallization continuing, the polar densities of the fiber textures of varied orientations in T1, T2, T3, T4 and other areas decreased gradually; in tensile test of Cu–Sn Alloy, yield strength and tensile strength at break decrease slowly.