Abstract
AbstractAmorphous (a-) Ge films were deposited on air-cleaved CaF2 (111) substrates at different deposition temperatures (Td). The films were irradiated with 0.9 MeV Ge or Si ions at low ion current intensity (1c) l00nA/cm2. Their structural changes were studied by Rutherford backscattering spectrometry (RBS) -channeling technique and thin film x-ray diffraction (XRD) measurement. It was found that the films were epitaxially crystallized by Ge and Si ion irradiation although they included randomly oriented grains. Ge ion irradiation was more effective for the crystallization than Si ion irradiation. However, the amount of the randomly oriented grains was slightly higher when using Ge ions. On the other hand, ion irradiation to the films prepared at high Td also exhibited higher incidence of randomly oriented grains.
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