Abstract
The effects of guanidine hydrochloride on electroless copper plating were studied by cyclic voltammetry and Tafel plot. An electrode from electroless deposited copper was used as the working electrode in these experiments. It was found that guanidine hydrochloride influences the plating process thermodynamically and kinetically. The surface composition and morphology of electroplated copper and electroless copper were studied by Auger spectroscopy and scanning electron microscope. The morphology of the electroless copper becomes rougher and porous because of guanidine hydrochloride. This is the other reason why guanidine hydrochloride enhances electroless copper deposition rate.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
