Effects of grinding parameters on surface quality in silicon nitride grinding

Abstract

To reveal the effects of the grinding parameters on the ground surface quality of silicon nitride grinding to guide processing for improving the processing accuracy and productivity, orthogonal experiments on silicon nitride grinding are carried out by a diamond grinding wheel, and the effects are studied systematically. The influences of the grinding parameters, such as the grain size, wheel speed, workpiece speed and grinding depth, are analysed regarding their effects on the grinding force, surface morphology, surface roughness and subsurface damage. The undeformed chip thickness and equivalent chip thickness are also studied to provide a comprehensive analysis of the ground surface quality. The quality and effectiveness of silicon nitride grinding can be improved by optimizing the grinding parameters according to this study.