Effects of grain size, dislocation density, and texture type on the etching behavior of Cu target in magnetron sputtering process

Abstract

Abstract Copper thin film is commonly applied in the microelectronics and battery industries, and environmentally friendly magnetron sputtering process is one of the main coating processes. The effects of grain size, dislocation density, and texture type of Cu target on sputtering efficiency were researched in this work. High-purity copper cast ingots were rolled into plates. Pieces were then cut from different surfaces of the plates and assembled into the targets named as Target 1, Target 2, and Target 3 for magnetron sputtering. To investigate the etching behavior of the three targets, EBSD technology was utilized for analysis, and the micro-morphologies of the etching grooves were observed using SEM. After the sputtering process, the weight loss rate and etching depth of the various targets were measured to compare the respective sputtering efficiency. Target 1 exhibited the highest sputtering weight loss rate at any time period compared to Target 2 and Target 3, and reached its maximum depth after every 15 minutes of sputtering. In the first 45 minutes, the etching depth of Target 2 was slightly greater than that of Target 3. While the etching depth of Target 3 increased significantly in the last 15 minutes compared to that of Target 2. The most significant factor influencing the sputtering efficiency of the target material was grain size, with finer grains leading to higher sputtering efficiency. The dislocation density had a greater impact in the first 30 minutes, but the texture type became more important as the sputtering process continued.