Abstract
Considering the advantages and disadvantages of CuW alloys with different single particle size of tungsten powder, CuW alloys with three kinds of tungsten powders: ultramicron (50 μm), micron(6–8 μm), submicron(0.4 μm) were prepared by the infiltration method. Microstructure of the CuW alloy with different grading ration of tungsten powder were characterized via field-emission scanning electron microscope (SEM). The Vacuum electrical breakdown properties were studied by electrical breakdown test. The results shows that the grading tungsten powders can form a variety of W-W sintered necks, strengthen the tungsten skeleton. SEM results show that a suitable ratio of grading tungsten powders can make the infiltrated copper phase more dispersed and uniform. Compared with the tradition CuW alloy, the conductivity is greater than 53.5%IACS, with the lowest hardness of 203HB, the lowest CuW/CrCu bonding strength of 417 MPa and the highest of 495 MPa, the hardness and electrical conductivity increased by 20%–30%, the bonding strength of new CuW/CrCu monolithic materials increased by 20%, vacuum electrical breakdown properties performed good.
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