Abstract
Sn-Ag-Cu (SAC) alloys have been regarded as the most promising candidates for lead-free solders in the electronic packaging industry. We prepared SAC solder-FeCo magnetic nanoparticles (MNPs) composite paste with different MNP concentration and used AC magnetic fields localized heating to cause their reflow. Differential scanning calorimetry results show a reduced undercooling of the composite paste with the addition of MNPs. Transmission electron microscope prove that the FeCo MNPs are distributed in Sn matrix of the reflowed solder composites. Optical micrographs show a decrease in the amount of primary Ag3Sn and β-Sn dendrites, and an increase in the amount of eutectic microconstituents with increasing MNPs. The addition of FeCo MNPs is considered to promote the solidification of β-Sn by providing more heterogeneous nucleation sites at a relatively low undercooling, which results in the microstructural refinement in the as-prepared solder joints.
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