Abstract
We have found that an undesirable SiNH component is reduced drastically from the low-temperature-deposited SiN surface by intense ArF excimer-laser irradiation on the low-temperature-deposited SiN film. This pre-annealing of the SiN film is very effective in forming an abrupt Si/SiN interface, and thus plays a very important role in high-performance excimer-laser-crystallized poly-Si/SiN thin-film transistors aiming at high-quality liquid-crystal displays. Annealing characteristics are also presented for the various SiN film thickness and for both the ArF and KrF excimer-laser lights.
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