Abstract
Abstract The effects of an electrical field on recrystallization of Cu have been investigated. A 12° off exact (1 1 2) [1 1 1 ¯ ] copper single crystal was rolled to 80% reduction. Samples cut from the deformed material were then annealed for 1 h at temperatures of between 200 °C and 400 °C. For each temperature, samples were annealed either with or without the presence of an electrical field of intensity 1500 V/cm. The microstructures were investigated in the longitudinal plane by using the electron backscatter pattern technique. Results show that the application of an external electric field might promote the grain growth rate, and also promote the formation of Σ3 twin boundary.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
