Abstract
AbstractStructural characterization techniques, including solid-state nuclear magnetic resonance and Fourier transform infrared spectroscopies, were used in conjunction with mechanical testing to study the effects of thermally activated electron bombardment curing on organosilicate thin films. The electron beam process produced significant improvements in elastic modulus and fracture resistance while still preserving low dielectric constant. Detailed and quantitative analysis was used to elucidate fundamental curing effects on glass structure, including changes in film composition and local bond rearrangements. Enhancements in fracture properties with curing are shown to be due to increased network bond density resulting from changes in network connectivity coupled with moderate film densification.
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