Effects of defrosting period on mold adhesion force of epoxy molding compound

Abstract

AbstractIn integrated circuit (IC) packaging, when epoxy‐molding compound (EMC) is filled in the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and the mold surface. Too large an adhesion force can cause many problems. For example, too large an adhesion force may damage an IC during ejection and cause the package to fail and thus lower the yield rate. To resolve mold adhesion problems, improving the mold design and applying suitable surface treatments, such as mold surface coating, are the common approaches. Applying suitable surface coating is a more popular and practical approach. Defrosting is a process to increase the frozen EMC temperature to room temperature, and to retain it at room temperature for some period before molding. It is a common practice to put EMC under required atmospheric environment during defrosting. It has been found by molding engineers that increased defrosting period will increase the frequency of mold cleaning. But there is no quantitative description on how much the adhesion force increases during the defrosting process.This paper describes the use of a semiautomatic EMC adhesion force test instrument to measure the normal adhesion force between the mold surface and EMC. By measuring the adhesion force, one can quantify how much adhesion force exists between EMC and the mold surface under different defrosting periods. The results show that it is best to use the EMC with 24–32 h of defrosting, to prevent excessive amount of mold adhesion force and it has been found that the adhesion force of the 24 h defrosting period will be 24% less than that of the 48 h defrosting period. Decreasing moisture absorption will decrease the increase in adhesion force for prolonged defrosting period cases. Copyright © 2008 Curtin University of Technology and John Wiley & Sons, Ltd.