Abstract
With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the Sn-58Bi solders, it was found that the wettability of the Sn-58Bi solders was obviously improved with addition of CuZnAl particles. When the addition of CuZnAl particles was 0.2 wt %, the wettability of the Sn-58Bi solder performed best. At the same time, excessive addition of CuZnAl particles led to poor wettability. However, the results showed that CuZnAl particles changed the melting point of the Sn-58Bi solder slightly. The microstructure of the Sn-58Bi solder was refined by adding CuZnAl particles. When the content of CuZnAl addition was between 0.1 and 0.2 wt %, the refinement was great. In addition, the interfacial IMC layer between new composite solder and Cu substrate was thinner than that between the Sn-58Bi solder and Cu substrate.
Highlights
As a kind of conventional solders, Sn–Pb solder was widely used in microelectronic packaging for past decades
Ma et al [13] found that the addition of Zn element into the Sn-58Bi solder could suppress the coarsening of Bi and the growth of IMCs between the Sn-58Bi solder and Cu substrate
The microstructure of each type of composite solders and the intermetallic compounds layers was observed by using scanning electron microscopy (SEM) with a voltage of 15 keV
Summary
As a kind of conventional solders, Sn–Pb solder was widely used in microelectronic packaging for past decades. Ma et al [13] found that the addition of Zn element into the Sn-58Bi solder could suppress the coarsening of Bi and the growth of IMCs between the Sn-58Bi solder and Cu substrate. It increased the tensile strengths of Sn-58Bi solder and improved the creep behavior remarkably. The effects of micro-CuZnAl particles addition on wettability, melting temperature, microstructure of the Sn-58Bi solder, and the IMC layer between the composite solder and Cu substrate were investigated
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