Abstract

The dielectric properties of epoxy resin mainly depend on its microstructures, especially the curing degree. In this paper, the reaction process of diglycidyl ether of bisphenol A (DGEBA)/methyl hexahydrophthalic anhydride (MHHPA) system is studied by differential scanning calorimetry, and samples with different curing degrees are prepared by regulating the curing temperature and time. It is inferred that the effect of the curing degree on dielectric properties can be attributed to the distribution of polar groups and the mobility of chain segments. With the increase of the curing degree, the epoxy group at the chain end is transformed into an ester group with weaker polarity, as well as the epoxy molecular segments are combined more closely and the mobility of molecules decreases, resulting in a change in the dielectric properties of the epoxy resin.

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