Abstract
Effects of minor Cu, Zn additions on the wettability, microstructures, and shear properties of Sn-Bi-based lead-free solder joints were investigated. The results show that a Cu addition promotes the wetting ratio of solder alloy, while Zn creates the opposite effect. The Cu5Zn8 intermetallic compound layer at the interface of Sn-40Bi-2Zn-0.1Cu and the Cu substrate alters the surface tension, which increases the contact angle. Also, this type of intermetallic compound contributes to the change of three wetting indicators. A proper amount of Cu, Zn increased the wetting force and decreased the wetting time, while the variation in the trend of withdrawing force is consistent with that of contact angle. From joint shear test results, the shear force decreased in the following order: Sn-40Bi-0.1Cu, Sn-58Bi, and Sn-40Bi-2Zn-0.1Cu solder joints. Cu additions refined the grain size of the Bi-rich phase and decreased the interface brittleness, which is the reason for the improvement of the shear strength of Sn-40Bi-0.1Cu solder joints. In contrast, Zn weakened the shear strength due to the brittle nature of the Zn-rich phase and the chemical activity of Zn.
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