Abstract
To elucidate the effects of Cu on the precipitation of intermetallic compounds and the intergranular corrosion of the hyper duplex stainless steels, a double loop potentiokinetic reactivation test, a scanning electron microscope analysis and thermodynamic calculation were conducted. The addition of Cu to the base alloy reduces the total amount of intermetallic compounds. Particularly, Cu addition to the base alloy results in pronouncedly suppressing the amount of sigma phase whereas it slightly increases chi phases. The Cu added alloy reduces the degree of sensitization due to the delayed precipitation of intermetallic compounds, compared with that of the base alloy.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
