Abstract

An experiment was performed to investigate the effects of interface temperature, specimen surface roughness, and contact pressure on thermal contact conductance (TCC). Specimens were prepared using SUS 304 stainless steel, the interface temperature was in the region of 360–640°C, the contact pressure was between 2.39 and 15.17MPa, and the surface roughness ranged from 0.25μm to 2.00μm. All experiments were conducted in ambient atmosphere. Results indicated that TCC presents a power law relationship with contact pressure and interface temperature. While the contact pressure exponent varied between 0.20 and 0.46 at different surface roughness, the interface temperature exponent showed a much wider range of 0.45–2.36. TCC increased more rapidly with temperature in specimens with higher surface roughness than in those with lower surface roughness. The correlation equations between thermal contact conductance, contact pressure, and interface temperature revealed a relative error of 20%.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.