Abstract
Thermal management of power electronics (PE) systems is a long-lasting challenge in their industrial applications. It is important to provide a uniform temperature distribution on the surface of the insulated gate bipolar transistors and diodes. The thermal management of a PE module is the main objective of the present study. The flow characteristics and the effects of the constructal theory on the heat transfer performance of the cooling system have been numerically investigated. The governing equations have been discretized using the finite volume method, and validation has been done to make sure the results are reliable. The effects of different channels configurations on decreasing the chips’ temperature and uniform temperature distribution on the chips’ surface have been studied. The flow characteristics and heat transfer performance at different mass flow rates for different channel configurations have been studied by presenting the results of the average chips’ temperature, Nusselt (Nu) number, pressure loss, and standard temperature deviation. Moreover, different temperature distribution contours have been presented to show the performance of different configurations. The results revealed that by changing the channels’ configuration from the conventional straight channel to leaf-inspired channels (case B and C), the cooling performance is improved.
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