Effects of Cold Spraying Process and Diamond Addition on Microstructure and Thermal Conductivity of Copper Matrix Composites

Abstract

The operation speed and integration degree of electronic components are getting higher and higher, which puts forward higher requirements for electronic packaging materials. Diamond is added to copper matrix composites to improve the thermal conductivity. The effects of cold spraying process and diamond addition on the microstructure and thermal conductivity of copper matrix composites are studied. The results show that the copper matrix composite prepared by cold spraying is a deformed strip copper layer. The change of cycle times has little effect on the microstructure, while the flattening rate of the deformed copper layer decreases as the carrier gas temperature increases. The diamond particles are uniformly distributed at the copper grain boundary after adding copper plated diamond powder, which are closely bound to the copper matrix. Increasing the temperature is conducive to increasing the thermal conductivity, while the change of cycle times has little effect on it. The addition of 20% diamond particles reduces the thermal conductivity, so the diamond content should be increased to play its role in thermal conductivity.