Abstract
Plasma enhanced chemical vapor deposition (PECVD) technology is playing an important role in industrial production, but the costs of its design and development can be very high. In this paper, a PECVD chamber was established and multiple physical fields such as electromagnetic field, temperature field and plasma field were coupled to study the influence of coil current density on plasma characteristics. The simulation results showed that with the increase of coil current density, electron density of plasma increased, electron temperature and electric potential decreased. Moreover, Langmuir probe was used to obtain plasma parameters for experiment validation, and the experimental data accorded with the simulation results, which reflected the rationality of simulation. This paper is of reference value for improving film deposition rate and uniformity.
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