Abstract
The influence of common slurry additives on the colloidal behavior of alumina suspensions and the surface characteristics of copper were investigated. The effects of the addition of glycine and H2O2 to aqueous suspensions of alpha-alumina at various pH values were studied by zeta potential and agglomerate size distribution measurements. Depending on the state of copper in solution, alumina agglomerate size was found to either increase or decrease. Nanohardness of 1 µm copper films deposited onto 30 nm Ta on a silicon wafer was measured after exposure to the same slurry solutions and was found to be significantly affected by pH and addition of chemical additives. The agglomeration behavior and hardness measurements suggest that the states of the copper in solution or on the surface are consistent with potential-pH diagrams.
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