Abstract
In this research, the objective was to investigate and measure the microstructure, tensile shear force, and fracture surface behavior when copper sheets are brazed using Cu-Ni-Sn-P amorphous filler metal. In order to examine the microstructure and its properties, assessment of the Cu-Ni-Sn-P/copper brazed joints was conducted after furnace brazing under an argon atmosphere using specific parameters relating to temperature, holding time, and loading pressure. In order to assess the tensile shear force, tensile testing was carried out. All the joints exhibited sound bonding without voids or cracks, when brazing temperatures reached 680 °C, this resulted in a maximum value for tensile shear force of 696.325 N. The microstructure consisted of both Cu-rich solid solution and a (Cu, Ni)3P phase as a eutectic structure formed in the brazing joint, and then the Cu-rich solid solution was produced as a matrix region around the eutectic structure. Fracture analysis was conducted for brazed joints which showed the ductile fractures after the shear test.
Highlights
Today there are numerous industrial applications for devices which employ both micro-channel process technology (MTP) and laminated micro-channel array (LMA). These include the conversion of natural gas to liquid form, the recovery of waste heat, and thermal management of laser diodes. While it is possible for large MPT devices to be constructed, with dimensions measured in meters, they include microchannel components in sizes measuring as little as 100 μm [1,2]
The most notable advantage offered by MPT devices over the conventional technologies is the large surface area to volume ratio, which permits much faster transfers of heat and mass inside the microchannels on account of the shortened distances over which diffusion takes place
This study performs the brazing of copper sheets using Cu-Ni-Sn-P amorphous filler metal, whereby the particular point of interest lies in the characteristics of the microstructure and the tensile shear force of the joints when different brazing temperatures are used
Summary
Today there are numerous industrial applications for devices which employ both micro-channel process technology (MTP) and laminated micro-channel array (LMA). These include the conversion of natural gas to liquid form, the recovery of waste heat, and thermal management of laser diodes. In the soldering process this method requires a low joining temperature and short joining time, suffers from a weaker joint and fluid stage emerges in the joining process and is unsatisfactory for high-temperature applications [6,7]. The ultrasonic welding process, requires a short joining time but yields low joint strength and is unsuited for high-temperature applications [9–12]. This study performs the brazing of copper sheets using Cu-Ni-Sn-P amorphous filler metal, whereby the particular point of interest lies in the characteristics of the microstructure and the tensile shear force of the joints when different brazing temperatures are used
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