Abstract

Boron marker-layer structures have been used to investigate the effects of B doping on the evolution of the implantation damage and of the associated transient enhanced diffusion. The samples were damaged by Si implants at different doses in the range 2×1013–1×1014 cm−2 and annealed at 740 °C for times between 2 s and 4 h. The values of interstitial supersaturation, from the beginning of the annealing up to the complete damage recovery, have been determined for the different Si doses for a given B doping level. Damage removal has been followed by double crystal x-ray diffraction. Our results confirm that the formation of boron-interstitial silicon clusters traps a relevant fraction of the interstitials produced by the implantation. This trapping action gives rise to a strong reduction of the interstitial supersaturation, prevents the interstitial clusters from being transformed in {113} defects and modifies the time evolution of the transient enhanced diffusion. X-ray analyses indicate also that the size of the boron-interstitial silicon clusters remains below 2 nm.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.