Abstract
A new bonding process using an Ag2O paste consisting of Ag2O particles mixed with a triethylene glycol reducing agent has been proposed as an alternative joining approach for microsoldering in electronics assembly, which currently uses Pb-rich, high-temperature solders. Ag nanoparticles were formed at approximately 130°C to 160°C through a reduction process, sintered to one another immediately, and bonded to a metal substrate. An Au-coated Cu specimen was successfully bonded using the Ag2O paste. The resulting joint exhibited superior strength compared with joints fabricated using conventional Pb-rich solders. To improve ion-migration tolerance, the Ag2O paste was mixed with Au and Pd microparticles to form sintered Ag-Au and Ag-Pd layers, respectively. The additions of Au and Pd improved the ion-migration tolerance of the joint. Regarding the mechanical properties of the joints, addition of secondary Au and Pd both resulted in decreased joint strength. To match the joint strength of conventional Pb-10Sn solder, the mixing ratios of Au and Pd were estimated to be limited to 16 vol.% and 7 vol.%, respectively. The electrical resistivities of the sintered layers consisting of 16 vol.% Au and 7 vol.% Pd were lower than that of Pb-10Sn solder. Thus, the additive fractions of Au and Pd to the Ag2O paste should be less than 16 vol.% and 7 vol.%, respectively, to avoid compromising the mechanical and electrical properties of the sintered layer relative to those of contemporary Pb-10Sn solder. Following the addition of Au and Pd to the paste, the ion-migration tolerances of the sintered layers were approximately 3 and 2 times higher than that of pure Ag, respectively. Thus, the addition of Au was found to improve the ion-migration tolerance of the sintered Ag layer more effectively and with less sacrifice of the mechanical and electrical properties of the sintered layer than the addition of Pd.
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