Abstract
The adhesive strength between microsized SU-8 columns and a silicon substrate under the bend loading condition has been studied to clarify effects of the columnar aspect ratio. The maximum tensile stresses at the root are almost the same within the range of high aspect ratios (1.4–2.1) of the SU-8 columns, in which delamination cracks are opened by bend loading (mode I). This result shows that the delamination is induced by the maximum tensile stress at the root. On the other hand, the maximum tensile stress irregularly changes within the range of low aspect ratios (0.8–1.1) of the specimens and features of the delamination surfaces differ from those within the range of high aspect ratios. This result suggests that the delamination mode must change from mode I to mode II or the complex mode. All the results show that the adhesive strength of a SU-8 column with the range of high aspect ratios of 1.4 and more obtained from the adhesive bend test can be analyzed as the maximum tensile stress at the root (the adhesive bend strength) in this study.
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