Abstract

0.94(Na0.5Bi0.5)TiO3–0.06BaTiO3 (NBT–BT6) ferroelectric thin films have been fabricated on Pt–Ti–SiO2–Si(100) substrate by metal–organic decomposition. The effects of annealing temperature (650–800°C) on the microstructure, and the piezoelectric, ferroelectric, and dielectric properties of the thin films were studied in detail. The residual stress was evaluated by the orientation average method to clarify its dependence on annealing temperature and grain size, and it was correlated with the electric properties to understand the mechanism of piezoelectric enhancement. Among the thin films, NBT–BT6 thin film annealed at 750°C has the largest effective piezoelectric coefficient, 95.1 pm/V, remnant polarization, 49.7 μC/cm2, spontaneous polarization, 105.2 μC/cm2, and dielectric constant, 504, and the lowest dielectric loss, 0.05, and tensile residual stress, 24.5 MPa. For the NBT–BT6 thin film annealed at 750°C, a wide temperature range, 183–210°C, around the phase transition temperature (Tm) was observed in the dielectric temperature plots, and the diffusion coefficients (γ) were quantitatively assessed as 1.6, 1.78, and 1.6. Piezoelectric performance is discussed on the basis of the dispersion phase transition and residual stress.

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