Abstract
We have reviewed the deposition of titanium nitride (TiN) thin films on stainless steel substrates by a DC magnetron sputtering method and annealing at different annealing temperatures of 500, 600, and 700°C for 120 min in nitrogen/argon atmospheres. Effects of annealing temperatures on the structural and the optical properties of TiN films were investigated using X-ray diffraction (XRD), atomic force microscope (AFM), field emission scanning electron microscopy (FESEM), and UV-VIS spectrophotometer. Our experimental studies reveal that the annealing temperature appreciably affected the structures, crystallite sizes, and reflection of the films. By increasing the annealing temperature to 700°C crystallinity and reflection of the film increase. These results suggest that annealed TiN films can be good candidate for tokamak first wall due to their structural and optical properties.
Highlights
Titanium nitride (TiN) thin films were used for diffusion barriers, gate electrodes in field-effect transistors (FET), contact layers in solar cells, and replacement of polycrystalline Si in large-scale integrated circuits due to their excellent hardness, wear resistance, and metallurgical and chemical stability [1,2,3,4]
It is known that facecentered cubic (FCC) structure of TiN may form when nitrogen atoms occupy all the octahedral sites of titanium with hexagonal closepacked (HCP) or body centered cubic (BCC) structures
The absence of a titanium peak in the X-ray diffraction (XRD) pattern demonstrates the absence of Ti atoms in the structure of the films and completes nitride formation process
Summary
Titanium nitride (TiN) thin films were used for diffusion barriers, gate electrodes in field-effect transistors (FET), contact layers in solar cells, and replacement of polycrystalline Si in large-scale integrated circuits due to their excellent hardness, wear resistance, and metallurgical and chemical stability [1,2,3,4]. For the most exposed areas in a tokamak, the aim is to develop materials that are heat resistant, thermally conductive, and resistant to physical and chemical erosion and show low fuel retention. The sputtering performance of plasma facing components (PFCs) surface materials is critical to future fusion devices. As recently reviewed in [12], erosion/redeposition codes have been extensively used to assess PFC sputtering performance, with most of the focus, being on b or limiter surfaces. Low Z materials (such as graphite), high melting point and high thermal conductivity (such as carbon and tungsten), low nuclear activation, and low propensity to absorb tritium (favouring tungsten most of all, steel and beryllium less, and all but ruling out carbon-based material) are considered to be candidate materials for the limiter and the wall which are the source of plasma impurities. Because of the high radiation of neutron and gamma rays in tokamak, all of the optical components that
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
