Abstract

Laser powder bed fusion (LPBF) has demonstrated its unique ability to produce customized, complex engineering components. However, processing of many commercial Al-alloys by LPBF remains challenging due to the formation of solidification cracking, although they are labelled castable or weldable. In order to elucidate this divergence, solidification cracking susceptibility from the steepness of the solidification curves, specifically |dT/df S 1/2 |, as the fraction solidified nears 1 towards complete solidification, was calculated via Scheil–Gulliver model as a function of solute concentration in simple binary Al-Si, Al-Mg, and Al-Cu systems. Introduction of “diffusion in solid” into Scheil–Gulliver model resulted in a drastic reduction in the cracking susceptibility (i.e., reduction in the magnitude of |dT/df S 1/2 |) and a shift in the maximum |dT/df S 1/2 | to higher concentrations of solute. Overall, the calculated solidification cracking susceptibility correlated well with experimental observation made using LPBF AA5083 (e.g., Al-Mg) and Al-Si binary alloys with varying Si concentration. Cracking susceptibility was found to be highly sensitive to the composition of the alloy, which governs the variation of |dT/df S 1/2 |. Furthermore, experimental observation suggests that the contribution of “diffusion in solids” to reduce the cracking susceptibility can be more significant than what is expected from an instinctive assumption of negligible diffusion and rapid cooling typically associated with LPBF.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.