Abstract
Creep behavior of the eutectic Sn-9Zn, Sn-9Zn-0.5Ag, and Sn-9Zn-0.5Al solder alloys was studied by impression testing under constant punching stress in the range of 60 MPa to 130 MPa and at temperatures in the range of 298 K to 370 K. Analysis of the data showed that, for all loads and temperatures, Sn-9Zn-0.5Al had the lowest creep rates and thus the highest creep resistance among all materials tested. The creep resistance of Sn-9Zn-0.5Ag was slightly lower than that of the Al-containing alloy. The enhanced creep behaviors of the ternary alloys are attributed to the presence of AgZn3 and very fine Zn particles, which act as the main strengthening agents in the Sn-9Zn-0.5Ag and Sn-9Zn-0.5Al alloys, respectively. Assuming a power-law relationship between the impression rate and stress, average stress exponents of 6.9, 7.1, and 7.2 and activation energies of 42.1 kJ mol−1, 42.9 kJ mol−1, and 43.0 kJ mol−1 were obtained for Sn-9Zn, Sn-9Zn-0.5Ag and Sn-9Zn-0.5Al, respectively. These activation energies are close to 46 kJ mol−1 for dislocation climb, assisted by vacancy diffusion through dislocation cores in the Sn. This, together with the stress exponents of about 7, suggests that the operative creep mechanism is dislocation climb controlled by dislocation pipe diffusion.
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