Abstract
In this study, the effects of open area ratio (OAR) variations by micro-patterns on Cu alloy electrodeposition were analyzed experimentally. To change the OAR of the samples, a strip-type micro-pattern was formed on a substrate through a photolithography process. Moreover, the OAR was controlled by adjusting the distance of the stripe pattern to a width of 20 μm. When electrodeposition was applied on a non-patterned substrate with an OAR of 100%, a pillar-type Cu alloy structure was produced. In addition, when the OAR was decreased to 40%, the height of the Cu alloy structures was increased. However, when the OAR was decreased to 20%, no electrodeposited structures were formed. To confirm the industrial effectiveness of the electrodeposited structures on a micro-pattern, the Cu alloy electrodeposited structures were applied to the formation of an oil detector.
Highlights
Micro- and nanostructured metal substrates are widely used in various industrial fields including surface modification, anti-corrosion, solar cells, and microelectronic interconnection [1,2,3,4,5]
Results of Cu alloy electrodeposition on non‐patterned substrate Figure 1 shows the results of Cu alloy electrodeposition on a non-patterned substrate with and without stirring
open area ratio (OAR) is the ratio of the electrodeposited area to the total top surface area of the sample, which is defined in Eq 3
Summary
Micro- and nanostructured metal substrates are widely used in various industrial fields including surface modification, anti-corrosion, solar cells, and microelectronic interconnection [1,2,3,4,5]. Electrodeposition methods allow the formation of various shapes of the metal alloy structure by controlling simple variables such as the stirring rate, temperature, and applied current density [11, 12]. We produced a Cu alloy microstructure on a stripe-type micro-patterned substrate.
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