Abstract
Electronics often experience overheating, which occurs when insufficient or improper cooling causes temperatures to rise quickly, potentially leading to component failure. Recently, a passive technique utilizing phase change material (PCM)-based heat sinks is suitable for modern electronic cooling. However, due to its low thermal conductivity, Aluminum (Al) foam as a thermal conductivity enhancer (TCE) is used. In this study, a partial filling approach is employed, involving a heat sink designed to cool a protruding electronic component (EC) attached to a metal fin. The enthalpy-porosity method and the thermal equilibrium model are applied. Results show that the efficiency of the heat sink is improved by increasing the filling ratio of the Al foam, thereby reducing the EC temperature by 15.85 °C, shortness the melting time by more than 1000 s, and the overall effective conductivity enhanced by 25 times compared to the case without Al foam. In addition, the optimal partial filling ratio is determined to be 2/3, due to the considerable savings of 33.33 % in material cost and overall heat sink weight. The findings suggest that partial filling is a strategy that can be employed to achieve a more comprehensive performance in thermal management using PCM-based heat sinks.
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