Abstract
Solution deposition planarization (SDP) was used to modify the flexible metal substrates for high temperature superconductor (HTS) tapes to ensure an available and effective surface for subsequent growth of buffer films. The surface morphologies with different tape speeds and coating layers were systematically investigated. 16 layers SDP-films decreased the surface roughness (RMS) from 11.74 to 0.788 nm for Hastelloy C-276 and 12 layers SDP-films decreased the RMS from 20.93 to 0.903 nm for SUS 304. Follow-up study confirmed that the low value of RMS (<1 nm) and high reflectivity of SDP-films exhibit superior characteristics for ion beam-assisted deposited (IBAD)-MgO, sputtered LaMnO3 films and YBCO films. A 10 m sample verified the stability of SDP-films on Hastelloy. The similar result for achieved SDP-films on SUS 304 (IcAVG = 110.1 A) and Hastelloy (IcAVG = 124.5 A) revealed the stainless steel has potential application value for coated conductor, which further reduced the cost of raw materials.
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