Abstract
The wettability, melting characteristics and thickness of intermetallic compound (IMC) layers of a Sn3.0Ag0.5Cu composite solder (SAC305) with four different contents (0.5 wt%, 1.0 wt%, 1.5 wt%, 2.0 wt%) of ZnO micron-particles were researched during aging. The results show that as the content of ZnO micron-particles increases, the wetting angle decreases and reaches a minimum at a content of about 1.5 wt%, while the expansion rate reaches a maximum. However, the effect on the melting point is not obvious; comparing the thicknesseses of the intermetallic compound(IMC) layer with different contents of ZnO micron-particles, it is found that the thickness of the IMC layer decreases with ZnO content increased to 1.5 wt%, which is mainly attributed to the fact that ZnO particles can reduce the diffusion coefficient. With comprehensive analysis of the three characteristics, it is revealed that the optimum addition amount of ZnO micron-particles is about 2.0 wt%.
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