Abstract
Reduction processes of copper oxide supported both on tetragonal and on monoclinic zirconia were investigated by means of hydrogen temperature-programmed reduction (H 2-TPR). Results show that there exists apparent difference between the reduction behaviour of highly dispersed CuO supported on these two-phase zirconia; while two reduction peaks appear in the H 2-TPR profile of monoclinic zirconia-supported monolayer CuO, only one reduction peak at low temperature is developed for tetragonal zirconia-supported counterpart.
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