Abstract
Thermosonic bonding process is a viable method to make reliable interconnections between die bond pads and leads using thin gold and copper wires. This paper investigates interface morphology and metallurgical behavior of the bond formed between wire and bond pad metallization for different design and process conditions such as varying wire size and thermal aging periods. Under thermal aging, the fine pitch gold wire ball bonds (0.6- and 0.8-mil-diameter wires) show formation of Kirkendall voids apart from intermetallic compound growth. With 1- and 2-mil-diameter gold wire bonds, the void growth is less significant and reveals fine voids. Studies also showed that void formation is absent in the case of thicker 3-mil wire bonds. Similar tests on copper ball bonds show good diffusional bonding without any intermetallic phase formation (or with considerable slow growth) as well as no voids on the microscopic scale and thus promises to be a better design alternative for elevated temperature conditions.
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