Abstract
A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire, based on rate-dependent crystal plasticity theory. The impact of wire diameter compression ratio on the micro-mechanical deformation behavior during the wire drawing process was investigated. Results indicate that the internal deformation and slip of the drawn wire are unevenly distributed, forming distinct slip and non-slip zones. Additionally, horizontal strain concentration bands develop within the drawn wire. As the wire diameter compression ratio increases, the strength of the slip systems and the extent of slip zones inside the deformation zone also increase. However, the fluctuating stress state, induced by contact pressure and frictional stress, results in a rough and uneven wire surface and diminishes the stability of the drawing process.
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