Abstract
ABSTRACT Blends of polyamide 6/polystyrene (PA6/PS) (50/50 wt./wt. %) were loaded with different concentrations of boron carbide (B4C), (0, 5, 10, 15, 20 and 30 wt./wt. %) separately for EMI shielding. The effects of different weight fractions of fillers on thermal, electrical, as well as, mechanical behavior of the prepared composites were investigated. Thermal stability and hardness (shore D) of composites are studied. Addition of B4C enhances thermal stability of the prepared composites which attributed to the increase in physical and chemical cross-linking points, also to the interactions between the filler and polymer blend. Confirmation of thermal stability was done by determining the activation energy (E a) for the thermal decomposition of all composites. Characterization of the prepared composites was done using SEM. With B4C-loaded PA6/PS blend composites, samples of 2 mm thick, SE values of 5–36 dB were achieved, satisfying the requirement for common commercial applications.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
