Abstract

Several kinds of Cu polycrystals with dispersed SiO2 particles of different volume fractions were tensile tested at high temperatures from 473 K to 1023 K. All of the alloys showed clear intermediate-temperature embrittlement (ITE). Although the temperature of minimum elongation was almost the same in all the alloys, temperature dependence of fracture strain depended strongly on the SiO2 volume fraction: (1) At a fixed temperature, the fracture strain tended to first decrease with increase in SiO2 volume fraction, showed minimum in an alloy with certain volume fraction, and increased again with increase in volume fraction. (2) With increase in SiO2 volume fraction, the temperature range of ITE became narrower and sharper. These results were reasonably understood by considering the occurrence of stress concentration at grain-boundary particles induced by grain-boundary sliding (GBS) and occurrence of dynamic recrystallization and stress relaxation by Cu/SiO2 interfacial diffusion.

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