Effect of various ratios of nitric acid – chloride on electronic properties of passive films on AISI 304L stainless steel

Abstract

AbstractIn this study, the electrochemical behavior of 304L SS stainless steel in various nitric acid/chloride ratios was investigated. The characteristics of the passive film, formed at the open circuit potential (OCP) and at the passive potential (0.65 V vs SCE) were also compared. OCP results show that a stable passive film formed over the surface with higher nitric acid/chloride ratios. Potentiodynamic polarization curves and electrochemical impedance spectroscopy (EIS) measurements showed that with higher nitric acid/chloride ratios, the film resistance increases (R1) for OCP, passive potential, and the critical current density (icrit) and corrosion rate (icorr) decreases. Mott–Schottky analysis revealed that the film formed at OCP shows n-type behavior for 0.01 N and 1 N concentration and shows p-type behavior for 0.1 N nitric acid concentration. At 0.65 V (vs. SCE) of film formation potential, the film formed in 1 N concentration shows n – type behavior. In 0.01 N and 0.1 N acid concentration, p-type behavior has been observed. Also, according to Mott–Schottky analysis, it was found that a lower defect density was found in 0.1 N nitric acid, for both the potentials. X-ray photoelectron spectroscopy spectra show evidence that the surface contains Fe and Cr as major elements. However, at OCP, Fe2O3was the main constituent of the passive film, whereas the passive potential film was rich in Cr2O3. In addition, nitrogen and chloride were adsorbed in the passive film at passive potential.