Abstract

In the present investigation, the sintering of CuNi (10 wt.%) bonded heavy alloys has been studied using two different particle sizes of tungsten, submicron range (0.74 μm) and micron range (3.03 μm). The sintering temperatures were 1400, 1450 and 1500 °C, and the sintering time was 1 h. Results show that an increase in the sintering temperature and/or the nickel content of the binder, enhances densification. The properties of the heavy alloys reveal an improvement when the fine tungsten powder is used. The results have been discussed on the basis of a solution-reprecipitation mechanism for liquid phase sintering, which correlates well with the spheroid coarsening of the tungsten particles.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call