Effect of Ti3C2Tx/Ag MXene fillers on the electrical conductivity of Ag-coated Cu conductive adhesives

Abstract

In this paper, we prepared ECAs (electrical conductive adhesives) with high electrical conductivity by using Ag-coated copper powder and M − II (Ti3C2Tx/Ag powder) as conductive filler. M-Ⅰ (Ti3C2Tx) and M-Ⅱ were prepared by acid etching and hydrothermal methods, respectively, and the electrochemical properties of M-Ⅱ and the effects of different contents of M-Ⅱ on the conductivity of ECAs were investigated. M − II has a unique reticular structure which helps to create conductive pathways, and its high specific surface area provides a large number of active sites for charge storage, resulting in increased electrical conductivity. The experimental results show that the best conductivity is achieved when the M-Ⅱ powder content is 1.2%, with a volume resistivity of 4.84 × 10−6 Ω m, at which time the Ag-coated Cu powder content is 69.8%. It has been shown in many studies that only when Ag-coated copper powder content is 70%–80%, the resistivity reaches about 10−6 Ω m. This work showed that adding a small amount of M − II and reducing the amount of Ag-coated copper powder could maintain the high electrical conductivity of ECAs.