Abstract
With the rapid development in the field of microelectronic devices, electrically conductive adhesives (ECAs), which are green and easy to connect, are urgently needed as a new alternative to tin-lead solder. Dendritic Ag-covered Cu (Cu@Ag) particles possessing low resistance and the two-dimensional structure of the conductive materials Ti3C2Tx/Ag/MWCNTs/Ag were combined with each other and used as ideal fillers for developing high-performance ECAs. The two-dimensional structure of the Ti3C2Tx/Ag/MWCNTs/Ag materials allowed for the establishment of large conductive paths within the colloid, followed by Cu@Ag particles filling the gaps within the framework as well as within the colloid, effectively increasing the conductive paths. The effect of the filling amount of the two-dimensional conductive materials Ti3C2Tx/Ag/MWCNTs/Ag on the volume resistance of the ECAs was systematically investigated. More importantly, the volume resistivity of ECAs reached 9.19 × 10−6 Ω m when the percentage of filled micron Cu@Ag particles reached 74 %. When further 0.6 g of Ti3C2Tx/Ag/MWCNTs/Ag filler materials were added, the volume resistance reached a minimum of 4.09 × 10−6 Ω m.
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