Effect of Ti additions on the electrical resistivity of copper

Abstract

Electrical resistivity of Cu Ti alloys containing 1.5, 2.7, 4.5 and 5.4 wt.% Ti, has been determined from the resistance values measured using Kelvins Bridge apparatus at room temperature. The resistivity in solution-treated alloys increases with Ti content linearly up to about 4.0 wt.% Ti, beyond which it decreases with further additions of Ti. However, in peak-aged condition, the resistivity continues to increase linearly up to 5.4 wt.% Ti without showing any decrease. Nordheim's rule of resistivity is followed up to approximately 4.0 wt.% Ti in the solution-treated alloys. Further, Nordheim's rule modified with the incorporation of the law of mixtures for two-phase systems ( ρ t = ρ m ν fm + ρ p ν fp) is obeyed right up to 5.4 wt.% Ti in the peak-aged alloys. The difference in behaviour is attributed to the fine scale precipitation formed during quenching in solution-treated Cu—4.5Ti and Cu—5.4Ti alloys, as revealed by transmission electron microscopy (TEM). The contribution to the total resistivity by β′-Cu 4Ti precipitate and prior cold deformation is considerable in deformed and peak-aged Cu Ti alloys.