Abstract
Cracking mechanism in IC plastic packages during reflow soldering was analyzed considering both vapor pressure and thermal stress. The vapor pressure induced stress, which was considered as the dominant factor for the IC package cracking, strongly depends on the total amount of absorbed water. The IC package cracking was observed, even when the vapor pressure induced stress was much lower than the strength of the molding compound, which was almost constant at temperatures above 200°C. The cracking was found to occur when the total amount of the stress, which was caused not only by the vapor pressure but also by thermal stress, reached the strength of the moling compound. Therefore, thermal stress is also the important factor for IC package cracking during reflow soldering.
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