Abstract
2.5D packages that utilize an interposer capable of fine patterning are gaining prominence for applications that require high data transmission rate, wide I/O bus, and higher integration of functionality. There are various interposer materials proposed such as silicon, glass, and organic. Silicon has high thermal conductivity compared to glass and organic. The authors studied thermal performance of Si interposer flip chip plastic ball grid array (FCPBGA), glass interposer FCPBGA and conventional multi chip module (MCM) FCPBGA assuming that a high power logic chip and a low power memory chip are packaged in each package configuration. Computational fluid dynamics (CFD) was used to analyze thermal performance of each package with the variation of heat dissipation configuration - lidless, lidded and heat sink attached on lid. The effects of airflow rate and power consumption of logic chip were also analyzed in this study.
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