Abstract
The adhesion strength of Ti/Ni/Ag multi-layers on AlN substrates before and after thermal cycling treatment was studied. The Ti/Ni/Ag layers with thicknesses of 0.6, 1.0, and 0.2μm, respectively, were deposited sequentially on bulk AlN substrates using direct current (DC) sputtering. Thermal cycling test (TCT) was conducted for 0, 15, 100, and 300 cycles to measure the adhesion strength of Ti/Ni/Ag on AlN. The adhesion strength of the deposited specimen increased slightly over 15 thermal cycles and increased abruptly after 100 thermal cycles. After 100 thermal cycles, Ti reacted with AlN substrate to form TiN and TiO. The formation of TiN and TiO at the Ti/AlN interface may be responsible for the increase of the adhesion strength after a large number of thermal cycles.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
