Abstract
The present study successfully bonded a TiBw/TA15 composite with a novel network architecture via a solid diffusion bonding (DB) technique. The effects of bonding time and TiB reinforcement phase on the evolution of the bonding interface were evaluated at 950 °C under a vacuum environment. Experimental results indicate that the interface bonding rate increased with the bonding time by reducing the interface voids and could well be bonded at 80 min. However, the TiB reinforcement phase was pernicious for the bonding process due to its low bonding strength with the sample matrix. Shear tests were also performed on the DB interface, and a maximum shear strength of 785 MPa was obtained when the sample was bonded at 2 MPa–950 °C–80 min.
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