Effect of the Thickness Uniformity in Micro-Electroforming Process by Dividing Conductive Zone on Cathode

Abstract

In this paper, an effective method is presented to improve thickness uniformity in nickel electroforming process. In most electroforming processes, thickness ratio of edge to center is 2.5~4 and the shape of the electroforming zone is naturally a concave. Dividing conductive zone of electroforming structure to redistribute current density was applied to improve electroforming uniformity. Theoretical analysis and experimental results verify that a proper dividing method can improve the electroforming uniformity effectively. In the experiment, the thickness ratio of edge to center decreases from 2.91 to 1.88.