Abstract
Silicon Carbide Film Fabrication As discussed in article 2200028 by Dailei Zhu, Wenbo Luo, and colleagues, plasma activation can significantly increase the active groups on the bonding surface, which is beneficial to improve the bonding strength. The bonding strength has a significant impact on the exfoliation process. When the bonding strength is too low to match the interface stress caused by thermal mismatch, the film will be separated from the surface.
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