Abstract
In the present work, we have studied numerically three dimensions, the impact of the position of parallelogram ribs in a micro-channel on thermal exchange. In this study, we proposed three cases of micro-channel heat sinks with parallelogram ribs. As well as one case without ribs, in each of the three cases, we varied the parallelogram rib positions on the micro-channel. The main purpose of this study is to find the best position for parallelograms ribs in which the heat dissipation is useful for improving the thermal performance of the micro-channel as well as improving the cooling of electronic components. We have chosen silicon micro-channel drains for four cases. Constant heat flux is applied to the bottom surfaces and using a nanofluid diamond-water with 5% volume concentration of diamond nanoparticle as a coolant. The simulation has been carried out using the commercial software ANSYS-Fluent. Reynolds number (Re) has been taken between 200 and 400 with the corresponding inlet velocity from 1.53 m/s to 3.01 m/s, and the flow regime has been assumed to be stationary. The numerical results show that the parallelogram ribs position of the micro-channel in the second case gave an improvement in heat exchange, where the Nusselt number is higher than in the other cases, and showed a reduction in the temperature of the heated bottom wall compared to the other cases. Also, the micro-channel shape in the second case can be used to cool the electronic components. The results also showed that with increasing Reynolds number (Re), the friction factor of the micro-channel decreases in all cases. At the same time, we find the lowest value of the thermal resistance in the second case and the biggest value in the first case, base micro-channel without ribs.
Highlights
The electronics industry has witnessed unmatched growth in recent times
Grid independence The independence of the mesh was tested as shown in Figures (4.a) and (4.b), which show the effect of the number of nodes used for the values of the Nusselt number (Nu), as well as on the values temperature in the micro-channel of case 1
ANSYS FLUENT was used to solve governing equations, which depends on the finite volume method (FVM) in solving them, and the finite volume method depends on the spatial integration of conservation equations on finite control volumes, which transforms the governing equations into a set of algebraic equations where they are solved
Summary
The electronics industry has witnessed unmatched growth in recent times. This exponential growth of electronic devices through the miniaturization of electronic components and the increased operating rate has led to problems with its high temperature. Their results showed between the three combinations of the twisted conical strip insert, Co-Conical inserts present the biggest values of the thermal exchange coefficient (as about 17%) They found that the impact of increasing nanofluid concentration on heat performance is more important, especially during an increase in Reynolds number. Jadhav et al [4] performed a numerical investigation of the effect of different pin fin shapes (ellipse, circle, square, and hexagon) on microchannel They concluded that for fin pins at larger height and at high flow coolant inlet velocities, the values of Nusselt number increases. They found that the square pin fins are the best among the studied pin fin shapes in terms of thermal performance He et al [5] studied numerically the convective heat exchange of the H2O-Cu nanofluid with a volume concentration of solid (Cu) ranging from 1 to 3 % in a tube with one and with two twisted tapes. Another study by Miansari et al [6] numerically studied the impact of rectangular micro-channel height and Reynolds number
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